DOWSIL TC-4529
Harmonization Code : 3824.99.92.97 | Prepared binders for foundry molds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included: other : other : other
Main features
- One-Part Non-Curing Gap Filler
- Vertical-Position Retention
- Dispensable Thermal Gap Filling
Product Description
Dow Corning TC-4529 Thermal Gap Filler is a one-part, gray, non-curing thermal gap filler for dispensable thermal management in electronic assemblies. The material is designed to hold on vertical surfaces while providing a thermal-transfer path across filled gaps. Because it remains non-curing, application does not require component mixing or a cure schedule. Its dispensable format supports placement in gaps and on non-horizontal surfaces while the material remains in position. Applications include automotive and electronic thermal management where a non-curing, dispensable gap-filling material is required.
Key features
- No-Mix, No-Cure Installation: One-part thermal gap filler is supplied for direct placement without a cure step.
- Vertical-Hold Gap Filler: The formulation is designed to remain in position on vertical surfaces.
- Dispensable Thermal Gap Filling: The material forms a thermal-transfer interface across filled assembly gaps.
Applications
Automotive and electronic thermal management requiring a non-curing, dispensable gap filler.
