LOCTITE SI 5296
Harmonization Code : 8473.30.80.00 | Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472 ; Parts and accessories of the machines of heading 8471 ; Other; Other
Main features
- 150 to 235 mPa s Viscosity
- 7-Minute Tack-Free at 125 deg C
- 20.6 kV/mm Dielectric Strength
Product Description
LOCTITE SI 5296 is a one-component heat-cure silicone conformal coating for printed circuit boards and electronic assemblies. The clear-to-translucent liquid can be applied by selective robotic dispensing, brush, dip, or manual spray and fluoresces under UV light. Brookfield viscosity is 150 to 235 mPa s at 25 deg C. For a 2 to 5 mil coating, the material becomes tack free after 7 minutes at 125 deg C or 13 minutes at 108 deg C. Typical cured properties include 75% elongation and dielectric breakdown strength of 20.6 kV/mm.
Key features
- Coating Rheology: Brookfield viscosity is 150 to 235 mPa s at 25 deg C.
- Heat-Cure Schedule: A 2 to 5 mil coating becomes tack free after 7 minutes at 125 deg C or 13 minutes at 108 deg C.
- Application Flexibility: Can be applied by selective robotic dispensing, brush, dip, or manual spray.
Applications
Conformal coating of printed circuit boards and electronic assemblies.
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Mechanical Properties
Additional Information
As-supplied / before-processing properties
Typical as-supplied values under the stated methods and conditions.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Specific gravity | 1.0 | - | 25 deg C; typical |
| Non-volatile content | 90 | % | Typical |
| Viscosity | 150 to 235 | mPa s | Brookfield RVT; 25 deg C; spindle 1; 20 rpm |
After-processing / final-state properties
Typical cured-material values; cure and method context is retained where reported.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Glass transition temperature | -49 | deg C | ASTM E228; cured material |
| Thermal conductivity | 0.19 | W/(m K) | Typical cured material |
| Elongation | 75 | % | Cured 45 minutes at 125 deg C in a convection oven |
| Volume resistivity | 1.9x10^13 | ohm cm | Cured-material electrical test |
| Dielectric breakdown strength | 20.6 | kV/mm | Cured-material electrical test |
